| MESSEN  2010 |
Datum Messe Ort Halle Stand Bemerkungen
08 .Juni bis 10. Juni 2010 SMT Nürnberg . .

.
28. bis 30. September 2010 Microwave Paris
CNIT
la Défense

 

3

 VIA electronic GmbH together with Schott Electronic Packaging.
Stand Personal:
Franz Bechtold,
Thomas Bartnitzek
VIA electronic is expertised in the development and manufacturing of customer taylored LTCC circuits. Focus is given to complex hermetic packaging solutions in the RF area. Our customers benefit from 13 years experience on the market. VIA electronic permanently develops new products, improves the technology and optimises the processes. Investments into state of the art equipment guarantee the highest level of technology. All this is the bases for our well founded consultancy service at the beginning of any project.