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| PROJEKTE | |
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IMODAS Integration of Modular Driver Systems for
Industrial Equipment Based on the "Microsystem Component Kit" |
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| Focus of this project is the development of different semicustomized modular microsystem units with different functions such as Sensors, Actuators, controller and memories. The different functional modules will be 3-d assembled in innovative TB-BGA configuration. | Core of the Development is the exploitation of all advantages of LTCC technology for MEMS packaging like passive integration, integration of mechanical functions all combined with high electrical integration density and reliability. | |||
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Lead time: 01.01.2001 – 31.12.2003 Partner: TU Ilmenau, Bürkert, Festo, Gramm,
Jetter, Levitec, Programme: Microsystem Technology 2000+ Match-X Activity << zurück |
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