| PROJEKTE |

Match-Druck

Development and manufacturing of LTCC based Packaging Solutions for Pressure Sensor Systems

 
Development of packaging solutions for pressure sensors according to the Match-X modular system. Passive integration capability of LTCC will be the key element together with a high degree of miniaturisation and an excellent reliability performance.

Lead time :1.1.2002 to 31.12.2004

Partner: Aktiv-Sensor GmbH, Analog Microelectronics GmbH, Prontronic GmbH,
             Liebherr Aerospace GmbH, TU Darmstadt, FHG-IPA Stuttgart

Programme: Mikrosystemtechnik 2000+

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