Manufacturing Technologies for microstructured Inductivities having an improved  functional and parametric performance; Focus: Volume  capable technology for planar LTCC Microinductors.

Target of this project is the development of an embossing technology to be integrated into the LTCC manufacturing line. The embossed structures together with screen printed conductors are intended to provide a high cross section wiring for high currency together with new ferrite  LTCC materials for high inductivity.

Lead time:

Partner: Angaris, W.C. Heraeus, Micro-Hybrid, Steinbeis-Transferzentrum, TU Ilmenau, Forschungs-und Transferzentrum e.V. an der HTWK Leipzig.

BMBF Programme: Research for tomorrows production techniques

Project sponsor: FZ Karlsruhe