| PROJEKTE |

NIKOL

New reaction controlled ceramic for the integration of passive components in power electronic modules. Focus: development and manufacturing of LTCC modules with integrated passive components using functional layers.
 
 

Target of this project is the development of a manufacturing technology and the manufacturing of modules under volume conditions using multilayer LTCC technology based    on    newly   developed dielectric and

ferritic ltcc foils and arriving at ltcc integrated capacitive and inductive power components, can embossing technology to be integrated into the LTCC manufacturing line. The embossed structure.
Lead time: 01.10.2005 – 30.09.2008
Partner: EAG, SIEMENS, Fachhochschule Jena, Hermsdorfer Institut für Technische Keramik. Bundesanstalt für Materialforschung, W.C. Heraeus, Fraunhofer Institut für Zuverlässigkeit und Mikrointegration, Siegert TFT
Programme: Material Innovation for Industry and Society
Project sponsor: PT Jülich                                                                                                << zurück