| PROJEKTE |

RF-PLATFORM

Generic manufacturing and design technology platforms based on novel RF technologies

 

RF Platform will develop a service concept similar to Europractise, to which companies, universities and research organisations will have access to multi-project fabrication through a central service point.

 The consortium will provide multiple platforms, VIA contributes with MCM-C and package technology based on novel LTCC technology.
Lead time:  January 2006  to December 2008

Partner: VTT, University Ulm, Atmel, Fraunhofer Institut für Siliziumtechnologie, EADS, THALES, University  
               Uppsala, Sensys Traffic, University Oulu

EC Programme: FP 6 IST, Integrated Project                                                                    << zurück