VIA electronic:LTCC, Multilayer,Multichip Modules, Ceramic Packages

	\| PROJEKTE \|
	ZEMI Glas-ceramic foils and multilayer technology for packaging and passive integration in microsystem technology. Manufacturing and process optimiedd shaping of nanoscaled functional ceramic oxide powders.
	Target of this project is the development of a spectrum of application tailored foils and their		processing to microsystem components for high reliability with LTCC technology.
	Lead time: 01.04.2002 – 31.03.2006 Partner: Bundesanstalt für Materialforschung, W.C.Heraeus, Siegert TFT Programme: New Materials European Patent Nr. 1453091 Holder: VIA electronic, Bundesanstalt für Materialforschung, W.C. Heraeus, Siegert TFT << zurück