| PROJEKTE |
BMWI Lead Project: Energy minimized system integration. details
Development and manufacturing of LTCC based Packaging Solutions. details
Glas-ceramic foils and multilayer technology for packaging and passive integration in microsystem technology. Manufacturing and process optimiedd shaping of nanoscaled functional ceramic oxide powders. details
Integration of Modular Driver Systems for Industrial Equipment Based on the "Microsystem Component Kit". details
Functional Inorganic Nonmetallic Materials. details
Advanced LTCC Module Manufacturing Line for Automotive and Telecom Applications. details
Advanced RF Subsystems Exploiting High Power MEMS Switches. details
2010 - 2006
2005 -2002
2001 - 2000