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| APPLICATIONS | |
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In order to bring the latest results of micro system technique to the user in the machine-building industry, a modular system has been developed with the assistance of the Federal Ministry for Education and Research which has already won an excellent reputation in the research landscape under the name of MATCH-X Modular Micro Systems. LTCC as a modern casing technology with high functional integratability plays a key role in this new product family for applications in which a high degree of reliability, resistance to excessive heat and thermal shocks are crucial.The individual modules can be linked up with each other directly along the Z-axis or, in a conventional manner, in parallel on the circuit board. ![]() |
Extensive investigations are
being conducted, addressing the reliability and thermal stability |
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