| CERAMICAL  PACKAGES |

Manufacturing of very specialized and sophisticated packages is possible using LTCC®-Technology. The 3-dimensional build-up is giving most flexibility to the designer. Very flat packages as well as packages having a high frame and a deep cavity are feasable. High pin count outputs are not a problem by realizing LCC, Ball Grid and Land Grid Arrays. Interconnection and wiring inside the lid and the frame are additional features.

They result in completely new solutions. Stacked modules and modular package families following the Baukasten principle will be a reality. Beside their electrical and mechanical function, LTCC® packages enable the integration of micromechanical components and sensors. Even feed throughs for liquids and gases can be realized.