| FUNDAMENTALS of  LTCC |

LTCC® means "Low Temperature Cofired Ceramic". The core of this technology is a low temperature sintering, flexible ceramic foil. "Green" Tapes (= unsintered foils) are mechanically structured, printed with established thickfilm technology, laminated together and then sintered (cofired) at about 900°C. The result is a 3 dimensional wired high density multilayer board made of ceramic. 

The Multilayer Board is further processed with the well known interconnection technologies of screen printing, chip and wire bonding and populated with Surface Mount Technology.The board material consists of monolithic ceramic. The ability of mechanical treatment in the green stage enables complete new interconnection and packaging solutions. Cavities, Chip Carrier Structures, windows, even complex shapes and 3-dimensional forms are realized. Good dielectric properties and low resistivity of cofired inner conductors enable high frequency design. All components are placed at smallest room and the best wiring thanks to an unlimited number of dielectric layers.