New digital systems are coming. Fast signal processing for increasing data transfer rates is a must. This means short signal tracks, lowest parasitic capacities and shortest swichting times. All together at the smallest room. This requires high integration and packaging density, low thermal resistivity and flexibility in design.

Gigabit-data transfer rates in electronic processing, Multichip-Modules Intelligent Sensors, Flip-Chip

Applications, Chip size packages and others are indicating a clear trend: