ÿþ<html> <head> <title>VIA electronic:LTCC, Multilayer,Multichip Modules, Ceramic Packages</title> <title>VIA electronic opracowuje technologiê i produkuje i  : multilayerboards, multichip modules i zintegrowane obudowy</title> <meta name="copyright" content="media präsent, VIA electronic"> <meta name="author" content="f.schreiber"> <meta name="Description" Content="LTCC, moduly wielowarstwowe, ceramika wielowarstwowa, packaging, moduly HF, HF  design"> <meta name="keywords" content="LTCC, multilayer boards, multichip module, moduly wielowarstwowe, ceramika wielowarstwowa, packaging, moduly HF, HF  design, via electronic, ceramika, technologia grubowarstwowa, technologia wielowarstwowa, wypalanie ceramiki, polski,LTCC,Multilayer,Multichip modules,Multilayer keramik,Packages,multilayer boards,multilayer,multichip, HF-Design,Drucksensor module,via-electronic,keramik,ceramic,sintern,dickschichttechnik schichttechnologie,ltcc,Bondtechnologie,SMD-Technologie,SMD,multichip-module,multilayer-module,LCC, ball grid, land grid, Arrays, Thüringen,Match-X, Hermsdorf,"> <meta name="robots" content="index,follow"> <meta name="content-language" content="de,en,fr,it, nl, pl"> <meta name="company" content="VIA electronic : multilayerboards, multichip modules i zintegrowane obudowy"> <meta name="audience" content="alle"> <META http-equiv=Content-Type content="text/html; charset=windows-1252"> </head> <body bgcolor="#E7F1FC" onLoad="javascript: parent.Bildwechsel()"> <table border="0" style="border-collapse: collapse" bordercolor="#111111" width="663" height="1"> <tr> <td width="7" rowspan="4" height="1"> <img border="0" src="images/iframeheight.jpg" width="6" height="365"></td> <td width="1228" height="19" colspan="3" bgcolor="#E1EDFB"> <p align="center"><b> <font face="Arial" color="#CC6600" style="font-size: 11pt">| ZASTOSOWANIA |</font></b></td> </tr> <tr> <td width="567" height="91" valign="top"> <font SIZE="2" COLOR="#555555"> <p ALIGN="JUSTIFY"><font face="Arial">Obudowy LTCC, jako moduBy z wieloma zintegrowanymi funkcjami, peBni kluczow rol w zastosowaniach wymagajcych wysokiej niezawodno[ci w [rodowisku wysokich i zmiennych temperatur. Pojedyncze moduBy mog zosta poBczone ze sob w osi Z, jak i konwencjonalnie na PCB.</font> <br> &nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; </font></font> <img border="0" src="images/apllik2.jpg" width="182" height="65"></td> <td width="85" height="91">&nbsp;</td> <td width="521" height="91" valign="top"> <font FACE="Arial" SIZE="2" COLOR="#555555"> <img border="0" src="images/apllik1.jpg" align="left" width="217" height="150" vspace="2" hspace="2"><br>PrzykBadem wykorzystania zalet wynikajcych z zastosowania technologii LTCC mo|e by autonimiczny system do pomiaru ci[nienia, zbudowany z mikrokontrolera, jednostki magazynujcej dane i przetwornika A/C. A wszystko to zintegrowane zostaBo w jednej obudowie. &nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; <br> &nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; <a target="_self" href="p.applikationen1.htm"><font color="#555555">dalej</font></a> &gt;&gt;</font></td> </tr> <tr> <td width="567" height="1"></td> <td width="85" height="1"></td> <td width="521" height="1"></td> </tr> <tr> <td width="567" height="1"></td> <td width="85" height="1"></td> <td width="521" height="1"></td> </tr> </table> </body> </html>